SCINTIL PHOTONICS

PHOTONIC DEVICE COMPRISING A LAYER OF COMPONENTS ARRANGED ON A SUPPORT SUBSTRATE AND METHOD FOR PREPARING SUCH A PHOTONIC DEVICE

N° WO2025153192A1

INTEGRATED PHOTONIC DEVICE COMPRISING AN ELECTRO-OPTICAL LAYER AND METHOD FOR MANUFACTURING SAID DEVICE

N° WO2024251412A1

INTEGRATED PHOTONIC TRANSMISSION CIRCUIT CAPABLE OF OPERATING OVER AN EXTENDED TEMPERATURE RANGE

N° WO2024188623A1

Dispositif photonique comprenant une couche de composants disposée sur un substrat support et procédé de préparation d’un tel dispositif photonique

N° FR3158372A1

PHOTONIC CHIP PROVIDED WITH A MACH-ZEHNDER MODULATOR

N° EP4562472A1

PHOTONIC CHIP PROVIDED WITH A MACH-ZEHNDER MODULATOR

N° WO2024022795A1

Photonic chip provided with Mach-Zehnder modulator

N° CN119301517A

dispositif photonique intégré comprenant une couche électro-optique et procédé de fabrication de ce dispositif

N° FR3149700A1

LASER SOURCE HAVING A PLURALITY OF SPECTRAL LINES SEPARATED BY A DETERMINED SPECTRAL INTERVAL

N° EP4494225A1

LASER SOURCE HAVING A PLURALITY OF SPECTRAL LINES SEPARATED BY A DETERMINED SPECTRAL INTERVAL

N° US2025183613A1

LASER SOURCE HAVING A PLURALITY OF SPECTRAL LINES SEPARATED BY A DETERMINED SPECTRAL INTERVAL

N° WO2023174909A1

Circuit photonique intégré d’émission apte à fonctionner sur une plage de température étendue

N° FR3146735A1

PHOTONIC SYSTEM COMPRISING A LASER SOURCE CAPABLE OF EMITTING MULTISPECTRAL LIGHT RADIATION

N° US2025210930A1

METHOD FOR THE SPECTRAL POSITIONING OF A PHOTONIC SYSTEM AND PHOTONIC SYSTEM CARRYING OUT SUCH A METHOD

N° WO2023227257A1

METHOD FOR THE SPECTRAL POSITIONING OF A PHOTONIC SYSTEM AND PHOTONIC SYSTEM CARRYING OUT SUCH A METHOD

N° EP4533608A1

PHOTONIC SYSTEM COMPRISING A LASER SOURCE CAPABLE OF EMITTING MULTISPECTRAL LIGHT RADIATION

N° EP4494224A1

PHOTONIC SYSTEM COMPRISING A LASER SOURCE CAPABLE OF EMITTING MULTISPECTRAL LIGHT RADIATION

N° WO2023174590A1

Photonic system comprising laser source capable of emitting multispectral optical radiation

N° CN118830152A

PHOTONIC DEVICE PROVIDED WITH A LASER SOURCE AND MEANS FOR MANAGING DISSIPATION OF HEAT

N° WO2023072610A1

PHOTONIC DEVICE PROVIDED WITH A LASER SOURCE AND MEANS FOR MANAGING DISSIPATION OF HEAT

N° EP4423864A1

Photonic device provided with laser source and means for managing heat dissipation

N° CN118104089A

PHOTONIC DEVICE PROVIDED WITH A LASER SOURCE AND MEANS FOR MANAGING DISSIPATION OF HEAT

N° US2024421557A1

PHOTONIC CHIP ABLE TO EMIT AT LEAST ONE OUTPUT LIGHT EMISSION, AND OPTICAL COMPONENT EMPLOYING SUCH A CHIP

N° US2024396287A1

PHOTONIC CHIP ABLE TO EMIT AT LEAST ONE OUTPUT LIGHT EMISSION, AND OPTICAL COMPONENT EMPLOYING SUCH A CHIP

N° WO2023046434A1

PHOTONIC CHIP ABLE TO EMIT AT LEAST ONE OUTPUT LIGHT EMISSION, AND OPTICAL COMPONENT EMPLOYING SUCH A CHIP

N° EP4406152A1

Photonic chip capable of emitting at least one output light emission, and optical component employing such chip

N° CN117981244A

puce photonique pourvue d’un modulateur Mach-Zehnder

N° FR3138219A1

Procédé de positionnement spectral d’un système photonique

N° FR3136069A1

PHOTONIC CHIP PROVIDED WITH ONE OR TWO MACH-ZEHNDER MODULATORS

N° US2024369896A1

PHOTONIC CHIP PROVIDED WITH ONE OR TWO MACH-ZEHNDER MODULATORS

N° WO2023031530A1

PHOTONIC CHIP PROVIDED WITH ONE OR TWO MACH-ZEHNDER MODULATORS

N° EP4396629A1

Photonic chip provided with one or two Mach-Zehnder modulators

N° CN117916653A

Photonic assembly comprising a photonic component optically coupled with a photonic element

N° US2022397729A1

PHOTONIC ASSEMBLY COMPRISING A PHOTONIC COMPONENT OPTICALLY COUPLED WITH A PHOTONIC ELEMENT

N° WO2022258910A1

PHOTONIC ASSEMBLY COMPRISING A PHOTONIC COMPONENT OPTICALLY COUPLED WITH A PHOTONIC ELEMENT

N° EP4352569A1

Photonic assembly comprising photonic component optically coupled with photonic element

N° CN117460986A

Procédé de positionnement spectral d’un système photonique

N° FR3136070A1

METHOD FOR MANUFACTURING A PHOTONIC DEVICE PROVIDED WITH AT LEAST TWO PHOTONIC CHIPS, AND PHOTONIC DEVICE

N° US2024159961A1

METHOD FOR MANUFACTURING A PHOTONIC DEVICE PROVIDED WITH AT LEAST TWO PHOTONIC CHIPS, AND PHOTONIC DEVICE

N° WO2022214748A1

Method for producing photonic device having at least two photonic chips, and photonic device

N° CN117120899A

METHOD FOR MANUFACTURING A PHOTONIC DEVICE PROVIDED WITH AT LEAST TWO PHOTONIC CHIPS, AND PHOTONIC DEVICE

N° EP4320471A1

Source laser présentant une pluralité de raies spectrales séparées d’un intervalle spectral déterminé

N° FR3133711A1

DISPOSITIF PHOTONIQUE POURVU D’UNE SOURCE LASER ET DE MOYENS DE GESTION DE LA DISSIPATION DE CHALEUR

N° FR3130086A1

PHOTONIC CHIP AND PHOTONIC COMPONENT INTEGRATING SUCH A CHIP

N° WO2022112679A1

PHOTONIC CHIP AND PHOTONIC COMPONENT INTEGRATING SUCH A CHIP

N° US2024004046A1

PHOTONIC CHIP AND PHOTONIC COMPONENT INTEGRATING SUCH A CHIP

N° EP4252036A1

Photonic chip and photonic component integrated with same

N° CN116507942A

PUCE PHOTONIQUE APTE A EMETTRE AU MOINS UN RAYONNEMENT LUMINEUX DE SORTIE, ET COMPOSANT OPTIQUE EMPLOYANT UNE TELLE PUCE

N° FR3127350A1

PUCE PHOTONIQUE POURVUE D’UN OU DEUX MODULATEURS MACH ZEHNDER

N° FR3126510A1

Photonic device for improved heat dissipation of III-V/SI heterogeneous lasers and associated manufacturing method thereof

N° CN116235372A

Photonic device with improved heat dissipation for III-V/Si heterogeneous laser and associated manufacturing method

N° US2023420911A1

PHOTONIC DEVICE WITH IMPROVED HEAT DISSIPATION FOR III-V/SI HETEROGENEOUS LASER AND ASSOCIATED MANUFACTURING METHOD

N° EP4229724A1

PHOTONIC DEVICE WITH IMPROVED HEAT DISSIPATION FOR III-V/SI HETEROGENEOUS LASER AND ASSOCIATED MANUFACTURING METHOD

N° WO2022079363A1

Assemblage photonique comprenant un composant photonique couplé optiquement avec un élément photonique

N° FR3124002A1

Procéde de fabrication d’un dispositif photonique pourvu d’au moins deux puces photoniques et dispositif photonique

N° FR3121783A1

PHOTONIC DEVICE FOR PROVIDING LIGHT RADIATION COMPRISING AN OPTICAL MODE IN A WAVE GUIDE

N° EP4133558A1

PHOTONIC CHIP, METHOD FOR ASSEMBLING AN OPTICAL PART AND SAID PHOTONIC CHIP, AND PHOTONIC COMPONENT RESULTING THEREFROM

N° WO2021260280A1

PHOTONIC CHIP, METHOD OF ASSEMBLING AN OPTICAL COMPONENT AND SAID PHOTONIC CHIP AND PHOTONIC COMPONENTS

N° CN115715377A

PHOTONIC CHIP, METHOD FOR ASSEMBLING AN OPTICAL PART AND SAID PHOTONIC CHIP, AND PHOTONIC COMPONENT RESULTING THEREFROM

N° EP4168838A1

도파관의 광학 모드를 포함하는 광 방사를 제공하기 위한 광자 디바이스

N° KR20220164726A

PHOTONIC CHIP, METHOD FOR ASSEMBLING AN OPTICAL PART AND SAID PHOTONIC CHIP, AND PHOTONIC COMPONENT RESULTING THEREFROM

N° US2023350140A1

PHOTONIC DEVICE FOR PROVIDING LIGHT RADIATION COMPRISING AN OPTICAL MODE IN A WAVE GUIDE

N° US2023132985A1

PHOTONIC DEVICE FOR PROVIDING LIGHT RADIATION COMPRISING AN OPTICAL MODE IN A WAVE GUIDE

N° CA3172554A1

PHOTONIC DEVICE FOR PROVIDING LIGHT RADIATION COMPRISING AN OPTICAL MODE IN A WAVE GUIDE

N° WO2021205086A1

PUCE PHOTONIQUE ET COMPOSANT PHOTONIQUE INTEGRANT UNE TELLE PUCE

N° FR3116615A1

DISPOSITIF PHOTONIQUE AVEC DISSIPATION THERMIQUE AMELIOREE POUR LASER HETEROGENE III-V/SI ET PROCEDE DE FABRICATION ASSOCIE

N° FR3115412A1

PUCE PHOTONIQUE, PROCEDE D’ASSEMBLAGE D’UNE PIÈCE OPTIQUE ET DE CETTE PUCE, COMPOSANT PHOTONIQUE EN RESULTANT

N° FR3111715A1

DISPOSITIF PHOTONIQUE POUR ETABLIR UN RAYONNEMENT LUMINEUX COMPRENANT UN MODE OPTIQUE DANS UN GUIDE D'ONDE

N° FR3109020A1