SEMCO ENGINEERING

DEVICE FOR SURFACE TREATMENT WITH PLASMA GENERATED EX SITU, AND RELATED METHOD

N° WO2014001709A1

MANDRIN ELECTROSTATIQUE A DISPOSITIF DE SERRAGE A EFFORT CONTROLE.

N° FR3003999A1

Capacitive electrostatic chuck for use in manufacturing e.g. semiconductor, has gas distribution network on one of ceramic plates, and sealing layer detachably and durably securing ceramic plates for sealing gas distribution network

N° FR3002082A1

Device for transferring supports of semiconductor substrates towards e.g. plasma enhanced chemical vapor deposition reactor, of treatment device, has CPU controlling displacement of arms, such that support is moved to waiting position

N° FR2998205A1

MULTI-WAFER HOLDER

N° WO2013050716A1

EQUIPEMENT DE TRAITEMENT DE SURFACE PAR PLASMA GENERE EX-SITU ET PROCEDE ASSOCIE.

N° FR2992822A1

PREHENSEUR MULTI-PLAQUETTES.

N° FR2980994A1

METHOD FOR PREPARING AN N+PP+ OR P+NN+ STRUCTURE ON SILICON WAFERS

N° WO2011135249A1

Method for preparing an n+pp+ or p+nn+ structure on silicon wafers

N° CN102971867A

++ ++ METHOD FOR PREPARING AN N+PP+ OR P+NN+ STRUCTURE ON SILICON WAFERS

N° KR20130129818A

Verfahren zur Herstellung einer Struktur vom n+pp+-Typ oder p+nn+-Typ auf Siliciumwafern

N° DE112011101439T5

Method for preparing an N+PP+ or P+NN+ structure on silicon wafers

N° US2013112260A1

HOLDER FOR SILICON WAFERS, AND METHOD FOR TREATING SAID WAFERS

N° WO2012127123A1

PROCEDE DE PREPARATION D’UNE STRUCTURE DE TYPE N+PP+ OU DE TYPE P+NN+ SUR PLAQUES DE SILICIUM

N° FR2959351A1