AVENI

Electrolyte comprising an accelerator agent for bottom-up copper electroplating and electrochemical copper deposition process on a substrate comprising at least one conductive exposed surface

N° TW202403116A

ELECTROLYTE COMPRISING AN ACCELERATOR AGENT FOR BOTTOM-UP COPPER ELECTROPLATING

N° WO2023194802A1

METHOD OF METALLIZATION WITH A NICKEL OR COBALT ALLOY FOR THE MANUFACTURE OF SEMICONDUCTOR DEVICES

N° WO2023187473A1

Method of metallization with a nickel or cobalt alloy for the manufacture of semiconductor devices

N° TW202403100A

ELECTROLYTE AND METHOD FOR COPPER AND GRAPHENE ELECTRODEPOSITION

N° WO2022243462A1

Electrolyte and method for copper and graphene electrodeposition

N° TW202307279A

Electrolyte and method for cobalt electrodeposition

N° TW202235687A

ELECTROLYTE AND METHOD FOR COBALT ELECTRODEPOSITION

N° WO2022175137A1

Electrolyte and Method for Cobalt Electrodeposition

N° US2024133028A1

Process for fabricating a 3D-NAND flash memory

N° TW202220112A

PROCESS FOR FABRICATING A 3D-NAND FLASH MEMORY

N° WO2022074221A1

Electrodeposition of a cobalt or copper alloy, and use in microelectronics

N° IL284987A

Electrolyte and deposition of a copper barrier layer in a damascene process

N° TW202208694A

Electrolyte and Deposition of a Copper Barrier Layer in a Damascene Process

N° US2023282485A1

ELECTROLYTE AND DEPOSITION OF A COPPER BARRIER LAYER IN A DAMASCENE PROCESS

N° EP4189145A1

다마신 공정에서 구리 배리어층의 전해질 및 증착

N° KR20230085131A

ELECTROLYTE AND DEPOSITION OF A COPPER BARRIER LAYER IN A DAMASCENE PROCESS

N° WO2022012993A1

Electrolyte et procédé d'électrodéposition de cobalt et de graphène

N° FR3124197A1

Electrolyte et procédé d'électrodéposition de cuivre et de graphène

N° FR3123076A1

Method for fabricating 3D NAND using a nickel or cobalt alloy

N° TW202208680A

METHOD FOR FABRICATING 3D NAND USING A NICKEL OR COBALT ALLOY

N° WO2021219744A1

니켈 또는 코발트 합금을 사용한 3Ｄ ＮＡＮＤ 제조 방법

N° KR20210150415A

METHOD FOR FABRICATING 3D NAND USING A NICKEL OR COBALT ALLOY

N° EP4143882A1

Electrolyte et Procédé d’électrodéposition de cobalt

N° FR3119848A1

Méthode de fabrication de 3D-NAND mettant en œuvre un alliage de nickel ou de cobalt

N° FR3109839A1

Method for simulating the electrodeposition of a metallic layer on a wafer, and corresponding system

N° TW202131213A

METHOD FOR SIMULATING THE DEPOSITING BY ELECTRODEPOSITION OF A METALLIC LAYER ON A PLATE, AND CORRESONDING SYSTEM

N° WO2021079059A1

Procédé pour la fabrication d’une mémoire 3D-NAND

N° FR3115046A1

Procédé de fabrication additive d’une grille métallique pour dispositifs microélectroniques

N° FR3113849A1

Process for electrodeposition of cobalt

N° IL276902A

Electrolyte et dépôt d’une couche barrière au cuivre dans un procédé Damascène

N° FR3112559A1

Procédé de métallisation d’un substrat semi-conducteur, électrolyte et méthode de fabrication de 3D-NAND

N° FR3109840A1

Electrodeposition of a cobalt or copper alloy, and use in microelectronics

N° TW202045778A

ELECTRODEPOSITION OF A COBALT OR COPPER ALLOY, AND USE IN MICROELECTRONICS

N° EP3921460A1

ELECTRODEPOSITION OF A COBALT OR COPPER ALLOY, AND USE IN MICROELECTRONICS

N° CN113383115A

ELECTRODEPOSITION OF A COBALT OR COPPER ALLOY, AND USE IN MICROELECTRONICS

N° US2022090283A1

코발트 또는 구리 합금의 전착 및 마이크로일렉트로닉스에서의 사용

N° KR20210124422A

ELECTRODEPOSITION OF A COBALT OR COPPER ALLOY, AND USE IN MICROELECTRONICS

N° WO2020161256A1

Electrodéposition d’un alliage de cobalt ou de cuivre, et utilisation en microélectronique

N° FR3092590A1

Procédé simulation de dépôt par électrodéposition d’une couche métallique sur une plaquette, et système correspondant

N° FR3102593A1

Copper electrodeposition solution and process for high aspect ratio patterns

N° IL267531A

Method for temporary or permanent wafer bonding

N° TW202004995A

METHOD FOR TEMPORARY OR PERMANENT WAFER BONDING

N° WO2019202067A1

Process for electrodeposition of cobalt

N° TW201940746A

PROCESS FOR ELECTRODEPOSITION OF COBALT

N° EP3768880A1

PROCESS FOR ELECTRODEPOSITION OF COBALT

N° WO2019179897A1

PROCESS FOR ELECTRODEPOSITION OF COBALT

N° CN111771016A

Process for electrodeposition of cobalt

N° US2021079547A1

코발트 전착 공정

N° KR20200117024A

Electrodéposition d’un alliage de cobalt et utilisation en microélectronique

N° FR3092589A1

PROCEDE D'ELECTRODEPOSITION DE COBALT

N° FR3079241A1

PROCEDE D'ELECTRODEPOSITION DE COBALT

N° FR3079242A1

Copper electrodeposition solution and process for high aspect ratio patterns

N° TW201833390A

높은 종횡비 패턴을 위한 구리 전착 용액 및 공정

N° KR20190097129A

COPPER ELECTRODEPOSITION SOLUTION AND PROCESS FOR HIGH ASPECT RATIO PATTERNS

N° EP3562975A1

COPPER ELECTRODEPOSITION SOLUTION AND PROCESS FOR HIGH ASPECT RATIO PATTERNS

N° WO2018122216A1

Copper electrodeposition solution and process for high aspect ratio patterns

N° US2018363158A1

COPPER ELECTRODEPOSITION SOLUTION AND PROCESS FOR HIGH ASPECT RATIO PATTERNS

N° CN110168146A

SOLUTION D'ELECTRODEPOSITION DE CUIVRE ET PROCEDE POUR DES MOTIFS DE FACTEUR DE FORME ELEVE

N° FR3061601A1

Process for copper metallization and process for forming a cobalt or a nickel silicide

N° TW201727829A

CELL FOR A CHEMICAL REACTION WITH REDUCED VOLUME

N° EP3181732A1

PROCESS FOR COPPER METALLIZATION AND PROCESS FOR FORMING A COBALT OR A NICKEL SILICIDE

N° WO2017102834A1

PROCESS FOR GRAFTING A POLYMERIC THIN FILM ONTO A SUBSTRATE AND PROCESS FOR METALLIZING THIS THIN FILM

N° EP3359306A2

PROCESS FOR GRAFTING A POLYMERIC THIN FILM ONTO A SUBSTRATE AND PROCESS FOR METALLIZING THIS THIN FILM

N° WO2017060656A2

Copper electrodeposition process using tetramethylammonium

N° TW201804022A

Copper electrodeposition bath containing an electrochemically inert cation

N° IL246035A0

PROCEDE DE METALLISATION D'UN SUBSTRAT SEMI-CONDUCTEUR AVEC DU CUIVRE METTANT EN OEUVRE UN SILICIURE DE COBALT OU DE NICKEL

N° FR3045674A1

CELLULE POUR UNE REACTION CHIMIQUE A FAIBLES VOLUMES MORTS

N° FR3045676A1

Procédé de gravure chimique du dioxyde de silicium.

N° CH710482A2

PROCEDE DE GREFFAGE DE FILM MINCE POLYMERIQUE SUR SUBSTRAT ET PROCEDE DE METALLISATION DE CE FILM MINCE

N° FR3042133A1

Method for forming a metal silicide using a solution containing gold ions and fluorine ions

N° IL240138A0

Electrolyte and process for electroplating copper onto a barrier layer

N° IL237731B

PROCEDE DE GRAVURE CHIMIQUE DU DIOXYDE DE SILICIUM

N° FR3030108A1

MESA SEMICONDUCTOR DEVICE AND PRODUCTION METHOD

N° WO2015082828A1

COPPER ELECTRODEPOSITION BATH CONTAINING AN ELECTROCHEMICALLY INERT CATION

N° WO2015086180A1

Copper electrodeposition bath containing electrochemically inert cation

N° CN105899715A

Copper electrodeposition bath containing an electrochemically inert cation

N° US2015159291A1

COPPER ELECTRODEPOSITION BATH CONTAINING AN ELECTROCHEMICALLY INERT CATION

N° EP3080340A1

COPPER ELECTRODEPOSITION BATH CONTAINING AN ELECTROCHEMICALLY INERT CATION

N° SG11201604646TA

COPPER ELECTRODEPOSITION BATH CONTAINING AN ELECROCHEMICALLY INERT CATION

N° KR20160105808A

Machine suitable for plating a cavity of a semi-conductive or conductive substrate such as a through via structure

N° IL232679A0

Method for forming a metal silicide using a solution containing gold ions and fluorine ions

N° CN105074052A

METHOD FOR FORMING A METAL SILICIDE USING A SOLUTION CONTAINING GOLD IONS AND FLUORINE IONS

N° SG11201505902TA

Method for forming a metal silicide using a solution containing gold ions and fluorine ions

N° US2015380254A1

METHOD FOR FORMING A METAL SILICIDE USING A SOLUTION CONTAINING GOLD IONS AND FLUORINE IONS

N° WO2014128420A1

METHOD FOR FORMING A METAL SILICIDE USING A SOLUTION CONTAINING GOLD IONS AND FLUORINE IONS

N° EP2959036A1

METHOD FOR FORMING A METAL SILICIDE USING A SOLUTION CONTAINING GOLD IONS AND FLUORIDE IONS

N° KR20150125684A

METHOD FOR FORMING A METAL SILICIDE USING A SOLUTION CONTAINING GOLD IONS AND FLUORINE IONS

N° CA2899179A1

Method for forming a vertical electrical connection in a layered semiconductor structure

N° IL229519A0

Semiconductor device and its process of manufacture

N° TW201428923A

SEMICONDUCTOR DEVICE AND ITS METHOD OF FABRICATION

N° WO2014076431A2

Method of depositing metallic layers based on nickel or cobalt on a semiconducting solid substrate and kit for application of said method

N° IL228837A0

Electrolyte and process for electroplating copper onto a barrier layer

N° TW201418528A

ELECTROLYTE AND METHOD FOR ELECTRODEPOSITING COPPER ONTO A BARRIER LAYER

N° CA2885231A1

ELECTROLYTE AND PROCESS FOR ELECTROPLATING COPPER ONTO A BARRIER LAYER

N° KR20150056655A

Electrolyte and method for electrodepositing copper onto a barrier layer

N° CN104685107A

ELECTROLYTE AND PROCESS FOR ELECTROPLATING COPPER ONTO ABARRIER LAYER

N° SG11201502044VA

ELECTROLYTE AND METHOD FOR ELECTRODEPOSITING COPPER ONTO A BARRIER LAYER

N° WO2014044942A1

Electrolyte and process for electroplating copper onto a barrier layer

N° US2015218724A1

ELECTROLYTE AND METHOD FOR ELECTRODEPOSITING COPPER ONTO A BARRIER LAYER

N° EP2898121A1